Techbond Group Bhd
KLSE:TECHBND
We don't have any information about TECHBND's insider trading.
Techbond Group Bhd
Glance View
Techbond Group Bhd.is an investment holding company, which engages in the provision of management services. The company is headquartered in Shah Alam, Selangor. The company went IPO on 2018-12-05. The firm is principally involved in developing, manufacturing and trading of industrial adhesives, sealants and providing supporting products and services. Its supporting products and services include certain original equipment manufacturer (OEM) industrial adhesives and sealants, chemicals, adhesive repellents and cleaners, spare parts and maintenance services. The firm operates through two segments. Industrial Adhesives & Sealants segment manufactures two types of industrial adhesives, water-based adhesives and hot melt adhesives. The raw materials used are mainly plastics and polymer-based materials. Supporting Products & Services segment provides supporting products and services. These include providing OEM’s industrial adhesives and sealants, supply of adhesive repellent and cleaner, and chemicals, as well as adhesive mixing machines.
What is Insider Trading?
Insider trading refers to the buying or selling of a company’s stock by individuals with access to non-public, material information about the company.
While legal insider trading occurs when insiders follow disclosure rules, illegal insider trading involves trading based on confidential information and is prohibited by law.
Why is Insider Trading Important?
It isn't a coincidence that corporate executives seem to always buy at the right times. After all, they have access to every bit of company information you could ever want.
However, the fact that company executives have unique insights doesn't mean that individual investors are always left in the dark. Insider trading data is out there for all who want to use it.
Insiders might sell their shares for any number of reasons, but they buy them for only one: they think the price will rise.
