LB Semicon Co Ltd
KOSDAQ:061970
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LB Semicon Co Ltd
LB SEMICON Co., Ltd. engages in the provision of flip chip bumping services. The company is headquartered in Pyeongtaek, Gyeonggi-Do. The company went IPO on 2011-01-31. The firm provides bumping services, which are applied in back-end manufacturing processes of display driver ICs (DDIs), complementary metal-oxide-semiconductor (CMOS) image sensors (CISs) and others. In addition, the Company engages in the provision of semiconductor test and packaging services. The firm distributes its products within domestic market and to overseas markets.
LB SEMICON Co., Ltd. engages in the provision of flip chip bumping services. The company is headquartered in Pyeongtaek, Gyeonggi-Do. The company went IPO on 2011-01-31. The firm provides bumping services, which are applied in back-end manufacturing processes of display driver ICs (DDIs), complementary metal-oxide-semiconductor (CMOS) image sensors (CISs) and others. In addition, the Company engages in the provision of semiconductor test and packaging services. The firm distributes its products within domestic market and to overseas markets.
