INNOX Advanced Materials Co Ltd
KOSDAQ:272290
INNOX Advanced Materials Co Ltd
Innox Advanced Materials Co., Ltd. develops and manufactures material for circuit and semiconductor. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2017-07-10. The firm produces flexible printed circuit board (FPCB) materials, such as flexible copper clad laminates (FCCLs), polyimide films and coverlay. The company also offers semiconductor packaging materials, including lead on chip (LOC) tapes, lead lock tapes (LLTs) and others, as well as organic light emitting diode (OLED) materials for displays. The firm provides its products under the brand names of INNOFLEX and INNOSEM. The firm distributes its products in domestic and overseas markets.
Innox Advanced Materials Co., Ltd. develops and manufactures material for circuit and semiconductor. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2017-07-10. The firm produces flexible printed circuit board (FPCB) materials, such as flexible copper clad laminates (FCCLs), polyimide films and coverlay. The company also offers semiconductor packaging materials, including lead on chip (LOC) tapes, lead lock tapes (LLTs) and others, as well as organic light emitting diode (OLED) materials for displays. The firm provides its products under the brand names of INNOFLEX and INNOSEM. The firm distributes its products in domestic and overseas markets.