QuickLogic Corp
NASDAQ:QUIK
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QuickLogic Corp
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QuickLogic Corp
QuickLogic Corp. operates as a semiconductor company, which designs, markets, and supports primarily Customer Specific Standard Products and secondarily, Field Programmable Gate Arrays, sensor software algorithms, software drivers, associated design software and programming hardware. The company is headquartered in San Jose, California and currently employs 48 full-time employees. The firm develops a full stack platform for artificial intelligence (AI), voice and sensor processing. Its platform is based on its embedded FPGA (eFPGA), intellectual property (IP), multi-core semiconductor system-on-chips (SoCs), and AI software. Its product includes ArcticPro, EOS, QuickAI, SensiML Analytics Toolkit, ArcticLink III, PolarPro3, PolarPro II, PolarPro, and Eclipse II products. Its products also include primarily FPGA families named pASIC3 and QuickRAM as well as programming hardware and design software. In addition to delivering its own semiconductor solutions, it has an IP business that licenses its eFPGA technology for use in other semiconductor companies SoCs. Its semiconductor solutions are available across three categories: Sensor Processing, Display and Smart Connectivity. Its eFPGA IP are developed on 250 nanometer (nm), 130nm, 90nm, 65nm, 40nm, 28nm and 22nm process nodes.
QuickLogic Corp. operates as a semiconductor company, which designs, markets, and supports primarily Customer Specific Standard Products and secondarily, Field Programmable Gate Arrays, sensor software algorithms, software drivers, associated design software and programming hardware. The company is headquartered in San Jose, California and currently employs 48 full-time employees. The firm develops a full stack platform for artificial intelligence (AI), voice and sensor processing. Its platform is based on its embedded FPGA (eFPGA), intellectual property (IP), multi-core semiconductor system-on-chips (SoCs), and AI software. Its product includes ArcticPro, EOS, QuickAI, SensiML Analytics Toolkit, ArcticLink III, PolarPro3, PolarPro II, PolarPro, and Eclipse II products. Its products also include primarily FPGA families named pASIC3 and QuickRAM as well as programming hardware and design software. In addition to delivering its own semiconductor solutions, it has an IP business that licenses its eFPGA technology for use in other semiconductor companies SoCs. Its semiconductor solutions are available across three categories: Sensor Processing, Display and Smart Connectivity. Its eFPGA IP are developed on 250 nanometer (nm), 130nm, 90nm, 65nm, 40nm, 28nm and 22nm process nodes.
Revenue: Q4 revenue was $3.7 million (down 35% YoY, up 84% QoQ); management expects Q1 revenue of $5.5 million ±10% and forecasts 50%–100% revenue growth in 2026 versus 2025.
Government funding: QuickLogic received a $13 million tranche for its ongoing U.S. government SRH program (contract ceiling discussed up to $89 million) and will begin recognizing revenue from that tranche in Q1.
SRH roadmap: Company delivered an internally funded SRH FPGA test chip (GF 12LP) and has dev-kit orders — management positions this as the start of a large storefront opportunity for discrete SRH FPGAs and embedded SRH eFPGA IP.
eFPGA momentum: Architectural enhancements (targeted initially at Intel 18A, extensible to 12LP and other advanced nodes) improved PPA and enabled wins and late-stage negotiations for large eFPGA Hard IP contracts, both defense and commercial.
Profitability & cash: Q4 non-GAAP gross margin was 20.8%; non-GAAP net loss was $2.9 million ($0.17/share). Cash at quarter end was $18.8 million (includes $15 million credit facility); raised ~$3.2 million on ATM in Q4.
Guidance: Q1 non-GAAP gross margin ~45% ±5% (full-year modeled at 57%); Q1 non-GAAP OpEx ~$3.2 million ±5% and full-year non-GAAP OpEx ~$13.5 million; Q1 net loss ~ $800,000 (~$0.04/share).
Storefront & tape-outs: Management plans three MPW tape-outs in 2026 to support storefront sales (2 fully covered by customer contracts, 1 partially covered).
Chiplet & commercial expansion: Proof-of-concept chiplet presented publicly; commercial eFPGA engagements (12nm data-center peripheral and Epson case study showing 50% power reduction) signal broader market traction beyond defense.
