ASTI Holdings Ltd
SGX:575
ASTI Holdings Ltd
ASTI Holdings Ltd. is an investment holding company, which engages in the provision of corporate management and advisory services to its subsidiary. The firm operates through two segments. Back-end Equipment Solutions and Technologies segment is mainly engaged in provision of solutions and technologies in the back end, including assembly, test and finishing, arena of the semiconductor industry. The Distribution and Services segment is engaged mainly in the provision of semiconductor applications in consumer electronics, computer peripheral and communication solutions. Its services include semiconductor manufacturing services, semiconductor packaging solutions, equipment contract manufacturing services and a services group. Semiconductor manufacturing services are mainly engaged in provision of semiconductor chip handling and inspection services, as well as programming services. Semiconductor packaging solution is engaged in the design and development of backend semiconductor packaging solutions that are best suited for mobility and 3C convergence markets.
ASTI Holdings Ltd. is an investment holding company, which engages in the provision of corporate management and advisory services to its subsidiary. The firm operates through two segments. Back-end Equipment Solutions and Technologies segment is mainly engaged in provision of solutions and technologies in the back end, including assembly, test and finishing, arena of the semiconductor industry. The Distribution and Services segment is engaged mainly in the provision of semiconductor applications in consumer electronics, computer peripheral and communication solutions. Its services include semiconductor manufacturing services, semiconductor packaging solutions, equipment contract manufacturing services and a services group. Semiconductor manufacturing services are mainly engaged in provision of semiconductor chip handling and inspection services, as well as programming services. Semiconductor packaging solution is engaged in the design and development of backend semiconductor packaging solutions that are best suited for mobility and 3C convergence markets.
