Tong Hsing Electronic Industries Ltd
TWSE:6271
Decide at what price you'd be comfortable buying and we'll help you stay ready.
|
Johnson & Johnson
NYSE:JNJ
|
US |
|
Berkshire Hathaway Inc
NYSE:BRK.A
|
US |
|
Bank of America Corp
NYSE:BAC
|
US |
|
Mastercard Inc
NYSE:MA
|
US |
|
UnitedHealth Group Inc
NYSE:UNH
|
US |
|
Exxon Mobil Corp
NYSE:XOM
|
US |
|
Pfizer Inc
NYSE:PFE
|
US |
|
Nike Inc
NYSE:NKE
|
US |
|
Visa Inc
NYSE:V
|
US |
|
Alibaba Group Holding Ltd
NYSE:BABA
|
CN |
|
JPMorgan Chase & Co
NYSE:JPM
|
US |
|
Coca-Cola Co
NYSE:KO
|
US |
|
Verizon Communications Inc
NYSE:VZ
|
US |
|
Chevron Corp
NYSE:CVX
|
US |
|
Walt Disney Co
NYSE:DIS
|
US |
|
PayPal Holdings Inc
NASDAQ:PYPL
|
US |
Tong Hsing Electronic Industries Ltd
Capital Expenditures
Tong Hsing Electronic Industries Ltd
Capital Expenditures Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Capital Expenditures | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Tong Hsing Electronic Industries Ltd
TWSE:6271
|
Capital Expenditures
-NT$1.5B
|
CAGR 3-Years
24%
|
CAGR 5-Years
3%
|
CAGR 10-Years
0%
|
|
|
Yageo Corp
TWSE:2327
|
Capital Expenditures
-NT$6.3B
|
CAGR 3-Years
23%
|
CAGR 5-Years
4%
|
CAGR 10-Years
-14%
|
|
|
Delta Electronics Inc
TWSE:2308
|
Capital Expenditures
-NT$47.9B
|
CAGR 3-Years
-30%
|
CAGR 5-Years
-22%
|
CAGR 10-Years
-20%
|
|
|
Gold Circuit Electronics Ltd
TWSE:2368
|
Capital Expenditures
-NT$6.8B
|
CAGR 3-Years
-71%
|
CAGR 5-Years
-58%
|
CAGR 10-Years
-26%
|
|
|
Elite Material Co Ltd
TWSE:2383
|
Capital Expenditures
-NT$9.8B
|
CAGR 3-Years
-15%
|
CAGR 5-Years
-52%
|
CAGR 10-Years
-45%
|
|
|
Unimicron Technology Corp
TWSE:3037
|
Capital Expenditures
-NT$26.1B
|
CAGR 3-Years
7%
|
CAGR 5-Years
-12%
|
CAGR 10-Years
-11%
|
|
Tong Hsing Electronic Industries Ltd
Glance View
Tong Hsing Electronics Industries Ltd. is engaged in the manufacturing and selling of electronic products. The company is headquartered in Taipei City, Taipei. The company went IPO on 2002-12-24. The firm's main products include power amplifier modules, ceramic heat sink substrates, hybrid integrated circuits, wafer reorganization, wafer testing, micro display modules, and others. High-frequency wireless communication modules are mainly used in mobile phones, wireless local area networks. The hybrid body circuit mainly uses ceramic circuit boards for the product assembly process, which is divided into thick film and thin film technologies. The ceramic circuit boards are mainly used in aviation, automotive, and medical fields. The imaging products are mainly used in digital cameras, digital cameras, mobile phones and tablet computers. The firm distributes its products to the Americas, Europe and other markets.
See Also
What is Tong Hsing Electronic Industries Ltd's Capital Expenditures?
Capital Expenditures
-1.5B
TWD
Based on the financial report for Dec 31, 2025, Tong Hsing Electronic Industries Ltd's Capital Expenditures amounts to -1.5B TWD.
What is Tong Hsing Electronic Industries Ltd's Capital Expenditures growth rate?
Capital Expenditures CAGR 10Y
0%
Over the last year, the Capital Expenditures growth was -12%. The average annual Capital Expenditures growth rates for Tong Hsing Electronic Industries Ltd have been 24% over the past three years , 3% over the past five years .
