iCatch Technology Inc
TWSE:6695
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iCatch Technology Inc
TWSE:6695
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iCatch Technology Inc
iCatch Technology, Inc. engages in the development of digital image signal processing, machine vision, IC design, and video integrated circuits. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2018-12-28. The firm mainly provides low-end image and video processing chips for low-end digital cameras, hunting trail cameras, simple automobile data recorders; middle-end image and video processing chips for medium and high-end digital cameras, sports cameras, network cameras and main automobile data recorders; high-end image and video processing chips for high-end digital cameras, 4K motion cameras, 360 virtual reality (VR) cameras, multi-channel splicing network cameras and high-end automobile data recorders, as well as other products, including mobile phone camera module image sensor processors (ISP) chips, used to improve mobile phone image quality, and low voltage differential signaling (LVDS) analog wired transmission and reception interface chips to connect remote photographic lens modules and center processing prime wafers.
iCatch Technology, Inc. engages in the development of digital image signal processing, machine vision, IC design, and video integrated circuits. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2018-12-28. The firm mainly provides low-end image and video processing chips for low-end digital cameras, hunting trail cameras, simple automobile data recorders; middle-end image and video processing chips for medium and high-end digital cameras, sports cameras, network cameras and main automobile data recorders; high-end image and video processing chips for high-end digital cameras, 4K motion cameras, 360 virtual reality (VR) cameras, multi-channel splicing network cameras and high-end automobile data recorders, as well as other products, including mobile phone camera module image sensor processors (ISP) chips, used to improve mobile phone image quality, and low voltage differential signaling (LVDS) analog wired transmission and reception interface chips to connect remote photographic lens modules and center processing prime wafers.