VIA Labs Inc
TWSE:6756
VIA Labs Inc
VIA Labs, Inc. principally engages in the development and sale of superspeed Universal Serial Bus controllers and communication interface technology solutions. The company is headquartered in Taipei, New Taipei. The company went IPO on 2019-12-20. The firm mainly designs, develops and sells USB 3.1 Gen1/Gen2 control chips, USB Type-C application control chips, USB Power Delivery power transmission control chips, battery charging and related power solution chips, and provides customized services for the chips. The firm's main products include USB 3.1 Gen1/Gen2 control chips, USB Type-C interface control chips and product design reference solutions, USB Power Delivery power management chips and transmission solutions.
VIA Labs, Inc. principally engages in the development and sale of superspeed Universal Serial Bus controllers and communication interface technology solutions. The company is headquartered in Taipei, New Taipei. The company went IPO on 2019-12-20. The firm mainly designs, develops and sells USB 3.1 Gen1/Gen2 control chips, USB Type-C application control chips, USB Power Delivery power transmission control chips, battery charging and related power solution chips, and provides customized services for the chips. The firm's main products include USB 3.1 Gen1/Gen2 control chips, USB Type-C interface control chips and product design reference solutions, USB Power Delivery power management chips and transmission solutions.