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033170
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KOSPI 200
Over the past 12 months, Signetics Corp has underperformed KOSPI 200, delivering a return of -8% compared to the KOSPI 200's +111% growth.
Stocks Performance
033170 vs KOSPI 200
Performance Gap
033170 vs KOSPI 200
Performance By Year
033170 vs KOSPI 200
Compare the stock's returns with its benchmark index and competitors. Gain insights into its relative performance over time.
Signetics Corp
Glance View
Signetics Corp. engages in the provision of semiconductor packaging services. The company is headquartered in Paju, Gyeonggi-Do. The company went IPO on 2010-11-26. The firm provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).
