BE Semiconductor Industries NV
AEX:BESI

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BE Semiconductor Industries NV Logo
BE Semiconductor Industries NV
AEX:BESI
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Price: 144.1 EUR -1.87%
Market Cap: 11.7B EUR

BE Semiconductor Industries NV
Investor Relations

In the ever-evolving realm of semiconductor equipment manufacturing, BE Semiconductor Industries NV (BESI) stands out as a pivotal player, masterfully orchestrating its operations from its headquarters in the Netherlands. Founded in 1995, BESI has carved out a niche for itself by specializing in advanced packaging and assembly equipment for the semiconductor industry. This Dutch firm is essentially the lifeline for semiconductor manufacturers, as it provides the necessary tools to enhance the functionality, performance, and reliability of microchips used across various applications—from smartphones to data centers, all the way to automotive technology. BESI's cutting-edge, high-precision machinery is designed to facilitate the highly complex process of chip packaging, which involves encapsulating chips and integrating them with the necessary electrical connections to form a complete and functional device. The company prides itself on innovation and continuous improvement, often working hand-in-hand with its clients to meet the ever-expanding demands for more sophisticated and efficient semiconductor solutions.

Revenue streams for BESI are diversified, but fundamentally revolve around the sale and servicing of its highly specialized equipment. The company's product segments include die attach systems, packaging systems, and plating systems, each essential at different stages of semiconductor assembly. Beyond the initial equipment sale, BESI fosters enduring client relationships through its comprehensive aftersales service, ensuring that its sophisticated machines remain operational and effective over the long term. Moreover, BESI has strategically positioned itself in key technology hubs around the globe, enabling it to capitalize on the burgeoning semiconductor demand from Asia, Europe, and the Americas. The firm’s financial health is bolstered not only by equipment sales but also by recurring revenues from high-margin service contracts, spare parts, and technical support services, embedding BESI deeply into the fabric of the semiconductor production process and assuring its sustained relevance in an industry that is both capital and knowledge-intensive.

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Last Earnings Call
Fiscal Period
Q3 2025
Call Date
Oct 23, 2025
AI Summary
Q3 2025

Order Momentum: Q3 orders rose 36.5% QoQ to EUR 174.7 million, with further order strength seen into Q4, signaling recovery in the assembly equipment market.

Revenue Decline: Q3 revenue fell 10.4% QoQ and 15.3% YoY, reflecting ongoing weakness in mobile and automotive, and lower hybrid bonding revenue.

Strong Guidance: Q4 revenue is expected to increase by 15% to 25% QoQ, with gross margin guided at 61% to 63%.

Hybrid Bonding & AI: Hybrid bonding orders are set to pick up in Q4 with growing adoption across both logic and HBM applications, driven by AI-related demand.

Share Buyback: EUR 100 million buyback completed in October with a new EUR 60 million program authorized.

Market Outlook: Besi expects to outgrow the overall market, citing strong positioning in advanced packaging for AI and data center applications.

Margin Impact: Gross margin pressured by FX and lower volumes, but management sees recovery potential as cycle improves.

Key Financials
Bookings
EUR 174.7 million
First 9 Months Revenue
EUR 425 million
First 9 Months Orders
EUR 434.6 million
Net Income (First 9 Months)
EUR 88.8 million
Cash and Deposits
EUR 518.6 million
Share Buyback
EUR 100 million completed, new EUR 60 million program authorized
Earnings Call Recording
Other Earnings Calls

Management

Mr. Richard W. Blickman
Chairman of Management Board, President & CEO
No Bio Available
Andrea Kopp-Battaglia
Senior Vice President of Finance
No Bio Available
Mr. Henk-Jan Jonge Poerink
Senior Vice President of Global Operations
No Bio Available
Mr. Chris Scanlan
Senior Vice President of Technology
No Bio Available
Mr. Edmond Franco
Vice President of Corporate Development
No Bio Available
Mr. Rene W. Hendriks
Senior Vice President of Sales - North America & Europe
No Bio Available
Mr. Peter Wiedner
Senior Vice President of Sub Micron Die Attach
No Bio Available
Mr. Jong Kwon Park
Senior Vice President of Sales & Customer Support - APAC
No Bio Available
Mr. Jeroen Kleijburg
Senior Vice President of Packaging
No Bio Available
Mr. Christoph Scheiring
Senior Vice President of Die Attach
No Bio Available

Contacts

Address
GELDERLAND
Duiven
Ratio 6
Contacts
+31263194500.0
www.besi.com