Winpac Inc
KOSDAQ:097800
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Winpac Inc
Winpac, Inc. engages in the provision of semiconductor packaging and test services. The company is headquartered in Yongin, Gyeonggi-Do and currently employs 563 full-time employees. The company went IPO on 2013-03-07. The firm provides package products and testing services. Its package products consist of fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP), flip chips, universal serial bus (USB) flash drive (UFD), solid state drive (SSD) and others. The firm offers testing on memory products, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash and pseudo-static random-access memory (PSRAM). The company also provides semiconductor test services. The firm provides its services with domestic market and to overseas markets.
Winpac, Inc. engages in the provision of semiconductor packaging and test services. The company is headquartered in Yongin, Gyeonggi-Do and currently employs 563 full-time employees. The company went IPO on 2013-03-07. The firm provides package products and testing services. Its package products consist of fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP), flip chips, universal serial bus (USB) flash drive (UFD), solid state drive (SSD) and others. The firm offers testing on memory products, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash and pseudo-static random-access memory (PSRAM). The company also provides semiconductor test services. The firm provides its services with domestic market and to overseas markets.
