KohYoungTechnologyInc
KOSDAQ:098460
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KohYoungTechnologyInc
Koh Young Technology, Inc. engages in the development and manufacture of inspection and measurement automation equipment. The company is headquartered in Seoul, Seoul. The company went IPO on 2008-06-03. The firm provides 3D solder paste inspection (SPI) systems, which are used for electronic products assemble and semiconductor manufacturing processes; semiconductor inspection equipment, which is used for bump inspection; 3D automated optical inspection (AOI) systems, which are used for surface mounts and others, and 3D sensors, which are used in mounters. The firm distributes its products in domestic and overseas markets.
Koh Young Technology, Inc. engages in the development and manufacture of inspection and measurement automation equipment. The company is headquartered in Seoul, Seoul. The company went IPO on 2008-06-03. The firm provides 3D solder paste inspection (SPI) systems, which are used for electronic products assemble and semiconductor manufacturing processes; semiconductor inspection equipment, which is used for bump inspection; 3D automated optical inspection (AOI) systems, which are used for surface mounts and others, and 3D sensors, which are used in mounters. The firm distributes its products in domestic and overseas markets.
