Simmtech Co Ltd
KOSDAQ:222800
If you don’t study any companies, you have the same success buying stocks as you do in a poker game if you bet without looking at your cards.
Utilize notes to systematically review your investment decisions. By reflecting on past outcomes, you can discern effective strategies and identify those that underperformed. This continuous feedback loop enables you to adapt and refine your approach, optimizing for future success.
Each note serves as a learning point, offering insights into your decision-making processes. Over time, you'll accumulate a personalized database of knowledge, enhancing your ability to make informed decisions quickly and effectively.
With a comprehensive record of your investment history at your fingertips, you can compare current opportunities against past experiences. This not only bolsters your confidence but also ensures that each decision is grounded in a well-documented rationale.
Do you really want to delete this note?
This action cannot be undone.
This alert will be permanently deleted.
Simmtech Co Ltd
SIMMTECH Co., Ltd. engages in the manufacture and sale of printed circuit board(PCB). The company is headquartered in Cheongju, Chungcheongbuk-Do. The company went IPO on 2015-08-07. The Company’s product portfolio consists of memory module PCB, dual inline memory module (DIMM) and small outline DIMM (SO-DIMM); mobile phone boards used for mobile phone and mobile Internet device (MID); solid state drive (SSD) module PCB; plastic ball grid array (PBGA) used for microprocessors and controllers; board on chip (BOC) used for mobile devices; flash memory card (FMC); multi-chip package (MCP); chip size package (CSP); flip chip CSP (FC-CSP) and system in package (SiP).
SIMMTECH Co., Ltd. engages in the manufacture and sale of printed circuit board(PCB). The company is headquartered in Cheongju, Chungcheongbuk-Do. The company went IPO on 2015-08-07. The Company’s product portfolio consists of memory module PCB, dual inline memory module (DIMM) and small outline DIMM (SO-DIMM); mobile phone boards used for mobile phone and mobile Internet device (MID); solid state drive (SSD) module PCB; plastic ball grid array (PBGA) used for microprocessors and controllers; board on chip (BOC) used for mobile devices; flash memory card (FMC); multi-chip package (MCP); chip size package (CSP); flip chip CSP (FC-CSP) and system in package (SiP).
