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ASM Pacific Technology Ltd
OTC:ASMVY

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ASM Pacific Technology Ltd
OTC:ASMVY
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Price: 39.88 USD -5.32% Market Closed
Market Cap: $5.5B

ASM Pacific Technology Ltd
Investor Relations

ASM Pacific Technology Ltd., a prominent player in the semiconductor and electronics assembly industry, stands as a pivotal force in powering the electronics we rely on daily. The company is lauded for its technological prowess in providing comprehensive solutions that span the entire line of semiconductor assembly and packaging equipment. From wafer processing to surface mount technology (SMT) solutions, ASM Pacific has carved a niche in crafting the tools and systems that enable the manufacturing of integrated circuits, LEDs, MEMS, and more. With a deep-seated commitment to innovation, they have become integral to the supply chains of many tech giants by delivering highly efficient, precise, and scalable assembly processes.

What sets ASM Pacific apart is its ability to harness cutting-edge technology to cater to evolving market needs while ensuring product reliability and cost-efficiency. The company's revenue streams primarily flow from the sale of its sophisticated equipment and solutions to major semiconductor industry players, alongside after-sales services and continuous engineering support. As the demand for smaller, faster, and more energy-efficient electronic devices continues to escalate, ASM Pacific remains poised to capitalize on these trends by pushing the forefront of technological advancements and maintaining robust R&D initiatives. By focusing on both current industry demands and future innovations, ASM Pacific Technology Ltd. not only strengthens its position in the market but also charts a course for sustained financial performance.

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Last Earnings Call
Fiscal Period
Q3 2025
Call Date
Oct 30, 2025
AI Summary
Q3 2025

Revenue Growth: Q3 2025 revenue reached $468 million, up 7.6% quarter-on-quarter and 9.5% year-on-year, driven mainly by strong SMT performance and ongoing AI demand.

TCB Leadership: ASMPT solidified its leadership in Thermo-Compression Bonding (TCB), winning first orders for HBM4 from two major memory players and remaining a primary supplier in HBM4 transition.

Profitability: The group delivered a profitable quarter, excluding restructuring costs, with adjusted net profit up 245.2% year-on-year to HKD 101.9 million, though down 24.4% quarter-on-quarter.

Margin Pressures: Group gross margin fell to 37.7%, below typical levels, due to higher SMT mix and lower margins in SEMI; SEMI gross margin was 41.3%.

Bookings Strength: Q3 bookings were $462.5 million, and the group expects flattish bookings in Q4, marking a seventh consecutive quarter of year-on-year bookings growth.

Q4 Guidance: Q4 revenue is projected at $470–530 million, up 6.8% quarter-on-quarter and 14.3% year-on-year at the midpoint, above market consensus.

Cost Saving Actions: The closure of the Shenzhen AEC plant is expected to enhance cost competitiveness and provide ongoing COGS savings.

AI & End-Market Demand: AI momentum is supporting both advanced packaging and mainstream business lines; China EV and AI infrastructure remain key demand drivers.

Key Financials
Revenue
$468.0 million
Bookings
$462.5 million
Adjusted Gross Margin
37.7%
Book-to-Bill Ratio
1.04
Backlog
$867.7 million
Adjusted Operating Profit
HKD 124.4 million
Adjusted Net Profit
HKD 101.9 million
Adjusted Earnings Per Share
HKD 0.24
SEMI Revenue
$240.5 million
SEMI Bookings
$207.8 million
SEMI Adjusted Gross Margin
41.3%
SEMI Adjusted Segment Profit
HKD 82.6 million
SMT Revenue
$227.5 million
SMT Bookings
$254.7 million
SMT Gross Margin
33.9%
SMT Segment Profit
HKD 163.0 million
Other Earnings Calls

Management

Mr. Cher Tat Ng
Group CEO & Executive Director
No Bio Available
Ms. Yifan Xu
Senior VP & Group CFO
No Bio Available
Mr. Yam Mo Wong
Group CTO & Group Executive VP
No Bio Available
Mr. Romil Singh
Head of Investor Relations
No Bio Available
Ms. Pua Gim Wee
Senior VP & Group Chief People Officer
No Bio Available
Mr. Tson Cheong Poh
Senior VP, Co-CEO of Semiconductor Solutions Segment and CEO of Opto & Display Business Unit
No Bio Available
Mr. Choon Khoon Lim
Senior VP, Co-CEO of Semiconductor Solutions Segment and CEO of ICD & CIS Business Units
No Bio Available
Isaac Law
Senior VP, MD of China Manufacturing Operations & COO of SEMI Segment
No Bio Available
Justin Tham
VP & CFO of SEMI Segment
No Bio Available
Mr. Josef Heinrich Ernst
Senior VP & CEO of SMT Solutions Segment
No Bio Available

Contacts

Address
19F, Gateway ts, 8 Cheung Fai Road, Tsing Yi, New Territories
Contacts
+85224242021.0
www.asmpacific.com