Lingsen Precision Industries Ltd
TWSE:2369
Lingsen Precision Industries Ltd
Lingsen Precision Industries Ltd. engages in the manufacture, research, development, process, test and trading of integrated circuit (IC) and semiconductor components. The company is headquartered in Taichung, Taichung. The firm mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The firm conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
Lingsen Precision Industries Ltd. engages in the manufacture, research, development, process, test and trading of integrated circuit (IC) and semiconductor components. The company is headquartered in Taichung, Taichung. The firm mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The firm conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
