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3S Silicon Tech., Inc. principally engages in the research, development, and manufacturing of high-power semiconductor die-bonding equipment for packaging. The company is headquartered in Sinfong, Hsinchu. The company went IPO on 2017-02-21. The firm produces semiconductor packaging equipment. Its main products include die bonders, clip attach devices, reflow furnaces, and glue dispensers. The die bonders are classified as the back-end packaging equipment in semiconductor equipment and are used in various electronic chip packaging.

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Taiwán TW
Fecha de salida a bolsa
21 feb., 2017
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