Signetics Corp
KOSDAQ:033170
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Signetics Corp
Change in Working Capital
Signetics Corp
Change in Working Capital Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Change in Working Capital | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
S
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Signetics Corp
KOSDAQ:033170
|
Change in Working Capital
₩4.2B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
SK Hynix Inc
KRX:000660
|
Change in Working Capital
-₩8.4T
|
CAGR 3-Years
-6%
|
CAGR 5-Years
-30%
|
CAGR 10-Years
-45%
|
|
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DB HiTek Co Ltd
KRX:000990
|
Change in Working Capital
-₩125.2B
|
CAGR 3-Years
11%
|
CAGR 5-Years
-19%
|
CAGR 10-Years
-7%
|
|
|
H
|
Hana Micron Inc
KOSDAQ:067310
|
Change in Working Capital
-₩139.8B
|
CAGR 3-Years
-18%
|
CAGR 5-Years
-37%
|
CAGR 10-Years
-14%
|
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|
L
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Leeno Industrial Inc
KOSDAQ:058470
|
Change in Working Capital
-₩24.1B
|
CAGR 3-Years
26%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
-3%
|
|
|
F
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Fadu Inc
KOSDAQ:440110
|
Change in Working Capital
-₩41.4B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
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Signetics Corp
Glance View
Signetics Corp. engages in the provision of semiconductor packaging services. The company is headquartered in Paju, Gyeonggi-Do. The company went IPO on 2010-11-26. The firm provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).
See Also
What is Signetics Corp's Change in Working Capital?
Change in Working Capital
4.2B
KRW
Based on the financial report for Sep 30, 2025, Signetics Corp's Change in Working Capital amounts to 4.2B KRW.
What is Signetics Corp's Change in Working Capital growth rate?
Change in Working Capital CAGR 1Y
-69%
Over the last year, the Change in Working Capital growth was -69%.
