Signetics Corp
KOSDAQ:033170
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Signetics Corp
Research & Development
Signetics Corp
Research & Development Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Research & Development | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
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S
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Signetics Corp
KOSDAQ:033170
|
Research & Development
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
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CAGR 10-Years
N/A
|
|
|
SK Hynix Inc
KRX:000660
|
Research & Development
-₩6.4T
|
CAGR 3-Years
-13%
|
CAGR 5-Years
-16%
|
CAGR 10-Years
-15%
|
|
|
DB HiTek Co Ltd
KRX:000990
|
Research & Development
-₩99.4B
|
CAGR 3-Years
-9%
|
CAGR 5-Years
-11%
|
CAGR 10-Years
-7%
|
|
|
R
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RFHIC Corp
KOSDAQ:218410
|
Research & Development
-₩10.7B
|
CAGR 3-Years
18%
|
CAGR 5-Years
2%
|
CAGR 10-Years
N/A
|
|
|
L
|
Leeno Industrial Inc
KOSDAQ:058470
|
Research & Development
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
F
|
Fadu Inc
KOSDAQ:440110
|
Research & Development
-₩66.1B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
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Signetics Corp
Glance View
Signetics Corp. engages in the provision of semiconductor packaging services. The company is headquartered in Paju, Gyeonggi-Do. The company went IPO on 2010-11-26. The firm provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).
