Hana Micron Inc
KOSDAQ:067310
Hana Micron Inc
Interest Expense
Hana Micron Inc
Interest Expense Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Interest Expense | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
H
|
Hana Micron Inc
KOSDAQ:067310
|
Interest Expense
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
SK Hynix Inc
KRX:000660
|
Interest Expense
₩975.2B
|
CAGR 3-Years
35%
|
CAGR 5-Years
30%
|
CAGR 10-Years
24%
|
|
|
DB HiTek Co Ltd
KRX:000990
|
Interest Expense
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
J
|
Jeju Semiconductor Corp
KOSDAQ:080220
|
Interest Expense
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
L
|
Leeno Industrial Inc
KOSDAQ:058470
|
Interest Expense
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
F
|
Fadu Inc
KOSDAQ:440110
|
Interest Expense
₩2.6B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
Hana Micron Inc
Glance View
Hana Micron, Inc. engages in the provision of semiconductor packaging products and testing services. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2005-10-11. The firm provides flip chip ball grid array (FCBGA) packaging, wafer level chip-scale packaging (WLCSP), system in package, multi chip packaging, quad flat no lead (QFN) packaging and others, which are applied in communication equipment, mobile phones, personal digital assistant (PDA) devices, digital cameras, digital video discs (DVDs), moving picture experts group audio layer three (MP3) players, digital televisions (TVs) and others. The firm also provides universal serial bus (USB) flash drives. The firm distributes its products within domestic market and to overseas markets.
