Hana Micron Inc
KOSDAQ:067310
Hana Micron Inc
Non-Reccuring Items
Hana Micron Inc
Non-Reccuring Items Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Non-Reccuring Items | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
H
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Hana Micron Inc
KOSDAQ:067310
|
Non-Reccuring Items
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
SK Hynix Inc
KRX:000660
|
Non-Reccuring Items
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
DB HiTek Co Ltd
KRX:000990
|
Non-Reccuring Items
₩14.4B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
J
|
Jeju Semiconductor Corp
KOSDAQ:080220
|
Non-Reccuring Items
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
L
|
Leeno Industrial Inc
KOSDAQ:058470
|
Non-Reccuring Items
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
F
|
Fadu Inc
KOSDAQ:440110
|
Non-Reccuring Items
-₩1.3B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
Hana Micron Inc
Glance View
Hana Micron, Inc. engages in the provision of semiconductor packaging products and testing services. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2005-10-11. The firm provides flip chip ball grid array (FCBGA) packaging, wafer level chip-scale packaging (WLCSP), system in package, multi chip packaging, quad flat no lead (QFN) packaging and others, which are applied in communication equipment, mobile phones, personal digital assistant (PDA) devices, digital cameras, digital video discs (DVDs), moving picture experts group audio layer three (MP3) players, digital televisions (TVs) and others. The firm also provides universal serial bus (USB) flash drives. The firm distributes its products within domestic market and to overseas markets.
