Innox Corp
KOSDAQ:088390
Innox Corp
INNOX Corp. engages in the development, manufacture, and sale of information technology materials. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2006-10-20. The Company' products consist of flexible printed circuit board (FPCB) materials, such as flexible copper clad laminates (FCCLs), coverlay films, back up plates, bonding sheets and others, and semiconductor packaging materials, including lead on chip (LOC) tapes used for memory semiconductors, lead lock tapes (LLTs) used for non-memory semiconductors, and spacers, among others. The firm provides its products under the brand name INNOFLEX and INNOSEM. The firm distributes its products within domestic market and to overseas markets.
INNOX Corp. engages in the development, manufacture, and sale of information technology materials. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2006-10-20. The Company' products consist of flexible printed circuit board (FPCB) materials, such as flexible copper clad laminates (FCCLs), coverlay films, back up plates, bonding sheets and others, and semiconductor packaging materials, including lead on chip (LOC) tapes used for memory semiconductors, lead lock tapes (LLTs) used for non-memory semiconductors, and spacers, among others. The firm provides its products under the brand name INNOFLEX and INNOSEM. The firm distributes its products within domestic market and to overseas markets.
