Formosa Advanced Technologies Co Ltd
TWSE:8131
Formosa Advanced Technologies Co Ltd
Formosa Advanced Technologies Co., Ltd. provides wafer probe and integrated circuit assembly, testing, and module turnkey services. The company is headquartered in Douliou, Yunlin and currently employs 2,391 full-time employees. The company went IPO on 2006-11-28. The firm provides services applied in thin small outline packages (TSOPs), small outline packages (SOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light emitting diodes (LED) wafers, among others. The firm operates its businesses principally in Taiwan, Hong Kong and South Korea.
Formosa Advanced Technologies Co., Ltd. provides wafer probe and integrated circuit assembly, testing, and module turnkey services. The company is headquartered in Douliou, Yunlin and currently employs 2,391 full-time employees. The company went IPO on 2006-11-28. The firm provides services applied in thin small outline packages (TSOPs), small outline packages (SOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light emitting diodes (LED) wafers, among others. The firm operates its businesses principally in Taiwan, Hong Kong and South Korea.
