INNOX Advanced Materials Co Ltd
KOSDAQ:272290
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EV/IC
Enterprise Value to Invested Capital (EV/IC) ratio compares a company`s total enterprise value to the capital invested in its business. It shows how efficiently the company`s market value reflects the funds used to generate returns.
Enterprise Value to Invested Capital (EV/IC) ratio compares a company`s total enterprise value to the capital invested in its business. It shows how efficiently the company`s market value reflects the funds used to generate returns.
Valuation Scenarios
If EV/IC returns to its 3-Year Average (1), the stock would be worth ₩40 119.13 (17% upside from current price).
| Scenario | EV/IC Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 0.9 | ₩34 300 |
0%
|
| 3-Year Average | 1 | ₩40 119.13 |
+17%
|
| 5-Year Average | 1.3 | ₩52 922.31 |
+54%
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| Industry Average | 1.7 | ₩67 235.39 |
+96%
|
| Country Average | 0.8 | ₩33 324.43 |
-3%
|
Forward EV/IC
Today’s price vs future invested capital
Peer Comparison
| Market Cap | EV/IC | P/E | ||||
|---|---|---|---|---|---|---|
| KR |
I
|
INNOX Advanced Materials Co Ltd
KOSDAQ:272290
|
645.6B KRW | 0.9 | 11 | |
| NL |
|
ASML Holding NV
AEX:ASML
|
471.1B EUR | 11.9 | 46.1 | |
| US |
|
Lam Research Corp
NASDAQ:LRCX
|
321B USD | 20 | 47.9 | |
| US |
|
Applied Materials Inc
NASDAQ:AMAT
|
308.8B USD | 11.3 | 39.4 | |
| US |
|
KLA Corp
NASDAQ:KLAC
|
226.4B USD | 20.4 | 49.7 | |
| US |
B
|
Brooks Automation Inc
LSE:0HQ1
|
210.4B USD | 129.1 | -3 636.7 | |
| JP |
|
Tokyo Electron Ltd
TSE:8035
|
21.8T JPY | 10.1 | 43.2 | |
| JP |
|
Advantest Corp
TSE:6857
|
20.2T JPY | 34 | 70 | |
| CN |
|
NAURA Technology Group Co Ltd
SZSE:002371
|
389.1B CNY | 6.8 | 70.5 | |
| US |
|
Teradyne Inc
NASDAQ:TER
|
53.9B USD | 15 | 97.3 | |
| JP |
|
Disco Corp
TSE:6146
|
7.8T JPY | 17.3 | 57.8 |
Market Distribution
| Min | 0 |
| 30th Percentile | 0.5 |
| Median | 0.8 |
| 70th Percentile | 1.7 |
| Max | 2 224.6 |
Other Multiples
INNOX Advanced Materials Co Ltd
Glance View
Innox Advanced Materials Co., Ltd. develops and manufactures material for circuit and semiconductor. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2017-07-10. The firm produces flexible printed circuit board (FPCB) materials, such as flexible copper clad laminates (FCCLs), polyimide films and coverlay. The company also offers semiconductor packaging materials, including lead on chip (LOC) tapes, lead lock tapes (LLTs) and others, as well as organic light emitting diode (OLED) materials for displays. The firm provides its products under the brand names of INNOFLEX and INNOSEM. The firm distributes its products in domestic and overseas markets.
