DI Corp
KRX:003160
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P/B
Price to Book (P/B) ratio compares a company`s market value to its book value. It shows how much investors are paying for each dollar of net assets on the balance sheet.
Price to Book (P/B) ratio compares a company`s market value to its book value. It shows how much investors are paying for each dollar of net assets on the balance sheet.
Valuation Scenarios
If P/B returns to its 3-Year Average (2.3), the stock would be worth ₩14 662.45 (58% downside from current price).
| Scenario | P/B Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 5.6 | ₩35 000 |
0%
|
| 3-Year Average | 2.3 | ₩14 662.45 |
-58%
|
| 5-Year Average | 1.5 | ₩9 393.24 |
-73%
|
| Industry Average | 2.3 | ₩14 537.62 |
-58%
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| Country Average | 1.1 | ₩7 051.83 |
-80%
|
Forward P/B
Today’s price vs future total equity
Peer Comparison
| Market Cap | P/B | P/E | ||||
|---|---|---|---|---|---|---|
| KR |
D
|
DI Corp
KRX:003160
|
910.6B KRW | 5.6 | 178.7 | |
| NL |
|
ASML Holding NV
AEX:ASML
|
451.6B EUR | 18.9 | 44.7 | |
| US |
|
Lam Research Corp
NASDAQ:LRCX
|
314.2B USD | 29.7 | 46.8 | |
| US |
|
Applied Materials Inc
NASDAQ:AMAT
|
302.5B USD | 13.9 | 38.6 | |
| US |
|
KLA Corp
NASDAQ:KLAC
|
237.2B USD | 43.4 | 52 | |
| US |
B
|
Brooks Automation Inc
LSE:0HQ1
|
210.4B USD | 122.7 | -3 636.7 | |
| JP |
|
Advantest Corp
TSE:6857
|
21.6T JPY | 32 | 74.9 | |
| JP |
|
Tokyo Electron Ltd
TSE:8035
|
20.7T JPY | 10.3 | 41.1 | |
| US |
|
Teradyne Inc
NASDAQ:TER
|
59.3B USD | 21.2 | 107 | |
| CN |
|
NAURA Technology Group Co Ltd
SZSE:002371
|
374.8B CNY | 9.8 | 67.1 | |
| JP |
|
Disco Corp
TSE:6146
|
8.3T JPY | 14.1 | 61.2 |
Market Distribution
| Min | 0.1 |
| 30th Percentile | 0.7 |
| Median | 1.1 |
| 70th Percentile | 2.3 |
| Max | 2 461.2 |
Other Multiples
DI Corp
Glance View
DI Corp. engages in the manufacture and sale of semiconductor testing equipment. The company is headquartered in Seoul, Seoul. The firm produces semiconductor inspection equipment such as monitoring burn-in testers (MBTs), test burn-in testers (TBTs), wafer level burn-in testers (WBTs), burn-in boards (BIBs) and wafer test boards (WTBs). In addition, it produces electronic components such as electromagnetic wave shielding, electro-magnetic interference (EMI) absorbers and thermal interface materials. The firm distributes its products within domestic market and to overseas market.
