Aehr Test Systems
NASDAQ:AEHR
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P/B
Price to Book (P/B) ratio compares a company`s market value to its book value. It shows how much investors are paying for each dollar of net assets on the balance sheet.
Price to Book (P/B) ratio compares a company`s market value to its book value. It shows how much investors are paying for each dollar of net assets on the balance sheet.
Valuation Scenarios
If P/B returns to its 3-Year Average (5.3), the stock would be worth $23.66 (75% downside from current price).
| Scenario | P/B Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 21.4 | $95.91 |
0%
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| 3-Year Average | 5.3 | $23.66 |
-75%
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| 5-Year Average | 6.4 | $28.54 |
-70%
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| Industry Average | 5.3 | $23.96 |
-75%
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| Country Average | 2.5 | $11.27 |
-88%
|
Forward P/B
Today’s price vs future total equity
Peer Comparison
| Market Cap | P/B | P/E | ||||
|---|---|---|---|---|---|---|
| US |
|
Aehr Test Systems
NASDAQ:AEHR
|
3B USD | 21.4 | -260.1 | |
| NL |
|
ASML Holding NV
AEX:ASML
|
481.6B EUR | 19.6 | 46.5 | |
| US |
|
Lam Research Corp
NASDAQ:LRCX
|
334.9B USD | 31.6 | 49.9 | |
| US |
|
Applied Materials Inc
NASDAQ:AMAT
|
331B USD | 15.2 | 42.2 | |
| US |
|
KLA Corp
NASDAQ:KLAC
|
253.8B USD | 46.4 | 55.7 | |
| US |
B
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Brooks Automation Inc
LSE:0HQ1
|
234.5B USD | 130.7 | -3 874 | |
| JP |
|
Advantest Corp
TSE:6857
|
21.4T JPY | 33.9 | 79.3 | |
| JP |
|
Tokyo Electron Ltd
TSE:8035
|
21T JPY | 10.8 | 42.9 | |
| US |
|
Teradyne Inc
NASDAQ:TER
|
65.3B USD | 23.3 | 117.7 | |
| CN |
|
NAURA Technology Group Co Ltd
SZSE:002371
|
342.5B CNY | 9.1 | 62 | |
| JP |
|
Disco Corp
TSE:6146
|
7.8T JPY | 14 | 60.8 |
Market Distribution
| Min | 0 |
| 30th Percentile | 1.5 |
| Median | 2.5 |
| 70th Percentile | 4.8 |
| Max | 147 580.5 |
Other Multiples
Aehr Test Systems
Glance View
Aehr Test Systems engages in the design, manufacture and marketing of test and burn-in products to the semiconductor manufacturing industry. The company is headquartered in Fremont, California and currently employs 79 full-time employees. The firm manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures and related accessories. The Company’s principal products are the Advanced Burn-In and Test System (ABTS), the FOX full wafer contact parallel test and burn-in systems, the MAX burn-in system, the WaferPak full wafer contactor, the DiePak carrier and test fixtures. The company develops, manufactures and sell systems, which are designed to perform reliability screening and stress testing, burn-in or cycling, of homogeneous and heterogenous logic and memory integrated circuits (ICs) sensors and optical devices. These systems can be used to simultaneously perform parallel testing and burn-in of packaged ICs, singulated bare die or ICs still in wafer form.