Jih Lin Technology Co Ltd
TWSE:5285
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P/B
Price to Book (P/B) ratio compares a company`s market value to its book value. It shows how much investors are paying for each dollar of net assets on the balance sheet.
Price to Book (P/B) ratio compares a company`s market value to its book value. It shows how much investors are paying for each dollar of net assets on the balance sheet.
Valuation Scenarios
If P/B returns to its 3-Year Average (2.3), the stock would be worth NT$67.08 (27% upside from current price).
| Scenario | P/B Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 1.8 | NT$53 |
0%
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| 3-Year Average | 2.3 | NT$67.08 |
+27%
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| 5-Year Average | 2.5 | NT$73.67 |
+39%
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| Industry Average | 2.7 | NT$78.81 |
+49%
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| Country Average | 1.7 | NT$50.07 |
-6%
|
Forward P/B
Today’s price vs future total equity
Peer Comparison
| Market Cap | P/B | P/E | ||||
|---|---|---|---|---|---|---|
| TW |
|
Jih Lin Technology Co Ltd
TWSE:5285
|
5.4B TWD | 1.8 | 34.6 | |
| NL |
|
ASML Holding NV
AEX:ASML
|
467.4B EUR | 18.7 | 44.2 | |
| US |
|
Lam Research Corp
NASDAQ:LRCX
|
324.5B USD | 29 | 45.8 | |
| US |
|
Applied Materials Inc
NASDAQ:AMAT
|
321.3B USD | 13.9 | 38.5 | |
| US |
|
KLA Corp
NASDAQ:KLAC
|
249.2B USD | 43.8 | 52.5 | |
| US |
B
|
Brooks Automation Inc
LSE:0HQ1
|
224.7B USD | 131.1 | -3 884.7 | |
| JP |
|
Advantest Corp
TSE:6857
|
21.6T JPY | 32 | 74.9 | |
| JP |
|
Tokyo Electron Ltd
TSE:8035
|
20.7T JPY | 10.3 | 41.1 | |
| US |
|
Teradyne Inc
NASDAQ:TER
|
62.7B USD | 21 | 106.1 | |
| CN |
|
NAURA Technology Group Co Ltd
SZSE:002371
|
374.1B CNY | 9.9 | 67.7 | |
| JP |
|
Disco Corp
TSE:6146
|
8.3T JPY | 14.1 | 61.2 |
Market Distribution
| Min | 0.4 |
| 30th Percentile | 1.3 |
| Median | 1.7 |
| 70th Percentile | 2.5 |
| Max | 156.9 |
Other Multiples
Jih Lin Technology Co Ltd
Glance View
Jih Lin Technology Co., Ltd. engages in the manufacture and sale of stamping lead frame for semiconductor industries. The company is headquartered in Kaohsiung, Kaohsiung. The company went IPO on 2012-09-12. The firm's main products include power unit lead frames, optoelectronic component lead frames, integrated circuit lead frames and plastic molds. The firm's products are mainly used in light-emitting diodes (LEDs), automotive electronic parts, personal computers (PCs), home appliances, consumer electronics and communication power components. The firm distributes its products in domestic market and to overseas markets, including mainland China and others.
