S

Shanghai Fudan Microelectronics Group Co Ltd
SSE:688385

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Shanghai Fudan Microelectronics Group Co Ltd
SSE:688385
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Price: 82.57 CNY 2.85%
Market Cap: 67.8B CNY

Bankruptcy Probability

Shanghai Fudan Microelectronics Group Co Ltd's probability of bankruptcy is 1.1%, making a collapse highly unlikely. The solvency score is 77/100 — a strong indicator of financial stability.

We take all the information about a company's solvency (such as how easily a company can pay interest on its outstanding debt, how much cash it has, the amount of debt, and more) and use it to estimate the probability of bankruptcy.

Very Low
Probability of Bankruptcy

Financial Position

Cash & ST Investments
+
3Y
-15%
5Y
-
10Y
-
Long-Term Investments
+
3Y
-19%
5Y
-
10Y
-
Debt
+
3Y
+2 991%
5Y
-
10Y
-

Solvency Ratios

Solvency Ratios Comparison
Shanghai Fudan Microelectronics Group Co Ltd Competitors

Country Company Market Cap D/E D/A Interest
Coverage
Altman
Z-Score
Quick
Ratio
Current
Ratio
Cash
Ratio
CN
Shanghai Fudan Microelectronics Group Co Ltd
SSE:688385
65.9B CNY
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US
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NASDAQ:NVDA
4.3T USD
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US
Broadcom Inc
NASDAQ:AVGO
1.6T USD
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TW
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
45.4T TWD
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US
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NASDAQ:MU
411B USD
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US
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NASDAQ:AMD
376.4B USD
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KR
SK Hynix Inc
KRX:000660
506.8T KRW
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US
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231.4B USD
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US
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172.3B USD
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US
Qualcomm Inc
NASDAQ:QCOM
165.5B USD
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US
Analog Devices Inc
NASDAQ:ADI
144.8B USD
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No Stocks Found
Is Shanghai Fudan Microelectronics Group Co Ltd at risk of bankruptcy?

Shanghai Fudan Microelectronics Group Co Ltd's probability of bankruptcy is 1.1%, making a collapse highly unlikely.

The probability of bankruptcy is estimated using credit risk models that assess its financial health, debt levels, interest coverage, and other solvency indicators.

How much debt does Shanghai Fudan Microelectronics Group Co Ltd have?

As of the latest report, Shanghai Fudan Microelectronics Group Co Ltd has total debt of 1.3B CNY. This includes both short-term (626m CNY) and long-term (627.4m CNY) debt.

You can find a full breakdown on its Balance Sheet.

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