LB Semicon Co Ltd
KOSDAQ:061970
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EV/OCF
Enterprise Value to Operating Cash Flow (EV/OCF) ratio compares a company`s total enterprise value to its operating cash flow. It shows how much investors are paying for each dollar of the company`s operating cash flow, including both equity and debt.
Enterprise Value to Operating Cash Flow (EV/OCF) ratio compares a company`s total enterprise value to its operating cash flow. It shows how much investors are paying for each dollar of the company`s operating cash flow, including both equity and debt.
Valuation Scenarios
If EV/OCF returns to its 3-Year Average (7.8), the stock would be worth ₩805.9 (84% downside from current price).
| Scenario | EV/OCF Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 49 | ₩5 050 |
0%
|
| 3-Year Average | 7.8 | ₩805.9 |
-84%
|
| 5-Year Average | 6.6 | ₩682.76 |
-86%
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| Industry Average | 17.7 | ₩1 824.51 |
-64%
|
| Country Average | 10 | ₩1 028.71 |
-80%
|
Forward EV/OCF
Today’s price vs future operating cash flow
Peer Comparison
| Market Cap | EV/OCF | P/E | ||||
|---|---|---|---|---|---|---|
| KR |
L
|
LB Semicon Co Ltd
KOSDAQ:061970
|
293.3B KRW | 49 | -1.9 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
4.9T USD | 47.4 | 41 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
2T USD | 69.1 | 80.2 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
53.2T TWD | 21.9 | 28.6 | |
| US |
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Micron Technology Inc
NASDAQ:MU
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549.9B USD | 17.8 | 22.8 | |
| KR |
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SK Hynix Inc
KRX:000660
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701.7T KRW | 15.9 | 19.8 | |
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Advanced Micro Devices Inc
NASDAQ:AMD
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494.6B USD | 63.1 | 114.1 | |
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Intel Corp
NASDAQ:INTC
|
326B USD | 34.5 | -1 220.8 | |
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|
Texas Instruments Inc
NASDAQ:TXN
|
214.3B USD | 31.2 | 43.1 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
208.8B USD | 135.2 | 260.6 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
186.2B USD | 37.6 | 68.8 |
Market Distribution
| Min | 0 |
| 30th Percentile | 5.8 |
| Median | 10 |
| 70th Percentile | 18.7 |
| Max | 2 215 163.4 |
Other Multiples
LB Semicon Co Ltd
Glance View
LB SEMICON Co., Ltd. engages in the provision of flip chip bumping services. The company is headquartered in Pyeongtaek, Gyeonggi-Do. The company went IPO on 2011-01-31. The firm provides bumping services, which are applied in back-end manufacturing processes of display driver ICs (DDIs), complementary metal-oxide-semiconductor (CMOS) image sensors (CISs) and others. In addition, the Company engages in the provision of semiconductor test and packaging services. The firm distributes its products within domestic market and to overseas markets.
