Greatek Electronics Inc
TWSE:2441
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EV/S
Enterprise Value to Sales (EV/S) ratio compares a company`s total enterprise value to its revenue. It shows how much investors are paying for each dollar of the company`s sales, including both equity and debt.
Enterprise Value to Sales (EV/S) ratio compares a company`s total enterprise value to its revenue. It shows how much investors are paying for each dollar of the company`s sales, including both equity and debt.
Valuation Scenarios
If EV/S returns to its 3-Year Average (2), the stock would be worth NT$67.58 (25% downside from current price).
| Scenario | EV/S Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 2.7 | NT$89.7 |
0%
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| 3-Year Average | 2 | NT$67.58 |
-25%
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| 5-Year Average | 2 | NT$65.69 |
-27%
|
| Industry Average | 2.9 | NT$97.45 |
+9%
|
| Country Average | 2.1 | NT$71.22 |
-21%
|
Forward EV/S
Today’s price vs future revenue
Peer Comparison
| Market Cap | EV/S | P/E | ||||
|---|---|---|---|---|---|---|
| TW |
G
|
Greatek Electronics Inc
TWSE:2441
|
51B TWD | 2.7 | 20.8 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
5.3T USD | 24.1 | 43.8 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
2T USD | 29.7 | 79.3 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
56.7T TWD | 13.9 | 31.5 | |
| US |
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
545.4B USD | 15.5 | 125.8 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
591.7B USD | 10.1 | 24.5 | |
| KR |
|
SK Hynix Inc
KRX:000660
|
701.7T KRW | 9.1 | 20.7 | |
| US |
|
Intel Corp
NASDAQ:INTC
|
424.4B USD | 8.2 | -1 589.7 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
244.4B USD | 13.7 | 45.8 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
229.3B USD | 48.5 | 286.2 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
191.7B USD | 16.6 | 70.8 |
Market Distribution
| Min | 0 |
| 30th Percentile | 1.3 |
| Median | 2.1 |
| 70th Percentile | 3.6 |
| Max | 385 201.6 |
Other Multiples
Greatek Electronics Inc
Glance View
Greatek Electronics, Inc. engages in the provision of packaging and testing services for integrated circuits. The company is headquartered in Jhunan, Miaoli. The company went IPO on 2000-10-26. The Company’s packaging products mainly include traditional leadframe package, quad flat no-lead package, solder ball array packages, flip-chip packages and 8-wafer-level advanced packages. The firm's testing services include wafer testing and finished product testing services. The firm conducts its businesses in Taiwan, the Americas, Hongkong, Europe and the rest of Asia.
