ChipMOS Technologies Inc
TWSE:8150
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P/OCF
Price to Operating Cash Flow (P/OCF) ratio compares a company`s market value to the cash it generates from its core operations.
Price to Operating Cash Flow (P/OCF) ratio compares a company`s market value to the cash it generates from its core operations.
Valuation Scenarios
If P/OCF returns to its 3-Year Average (4.7), the stock would be worth NT$26.55 (61% downside from current price).
| Scenario | P/OCF Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 11.9 | NT$67.8 |
0%
|
| 3-Year Average | 4.7 | NT$26.55 |
-61%
|
| 5-Year Average | 4.2 | NT$23.84 |
-65%
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| Industry Average | 18.6 | NT$106.17 |
+57%
|
| Country Average | 13.2 | NT$75.14 |
+11%
|
Forward P/OCF
Today’s price vs future operating cash flow
Peer Comparison
| Market Cap | P/OCF | P/E | ||||
|---|---|---|---|---|---|---|
| TW |
C
|
ChipMOS Technologies Inc
TWSE:8150
|
47.5B TWD | 11.9 | 95.9 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
5.3T USD | 49.6 | 42.4 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
2T USD | 63.3 | 75.2 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
58.7T TWD | 25.3 | 30.8 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
591.7B USD | 18.1 | 23 | |
| US |
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Advanced Micro Devices Inc
NASDAQ:AMD
|
545.4B USD | 67.6 | 120.3 | |
| KR |
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SK Hynix Inc
KRX:000660
|
701.7T KRW | 16.9 | 21.1 | |
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Intel Corp
NASDAQ:INTC
|
426.9B USD | 41.2 | -129.5 | |
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|
Texas Instruments Inc
NASDAQ:TXN
|
244.4B USD | 30.9 | 45.3 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
229.3B USD | 138.3 | 262.8 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
191.7B USD | 37.1 | 69.2 |
Market Distribution
| Min | 0.5 |
| 30th Percentile | 8.9 |
| Median | 13.2 |
| 70th Percentile | 20.4 |
| Max | 5 587.5 |
Other Multiples
ChipMOS Technologies Inc
Glance View
ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2013-04-19. The firm mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. The company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
