Signetics Corp
KOSDAQ:033170
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EV/OCF
Enterprise Value to Operating Cash Flow (EV/OCF) ratio compares a company`s total enterprise value to its operating cash flow. It shows how much investors are paying for each dollar of the company`s operating cash flow, including both equity and debt.
Enterprise Value to Operating Cash Flow (EV/OCF) ratio compares a company`s total enterprise value to its operating cash flow. It shows how much investors are paying for each dollar of the company`s operating cash flow, including both equity and debt.
Valuation Scenarios
If EV/OCF returns to its 3-Year Average (6.7), the stock would be worth ₩-1 034.06 (213% downside from current price).
| Scenario | EV/OCF Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | -5.9 | ₩912 |
0%
|
| 3-Year Average | 6.7 | ₩-1 034.06 |
-213%
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| 5-Year Average | 8.2 | ₩-1 264.6 |
-239%
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| Industry Average | 17.7 | ₩-2 739.56 |
-400%
|
| Country Average | 10 | ₩-1 544.64 |
-269%
|
Forward EV/OCF
Today’s price vs future operating cash flow
Peer Comparison
| Market Cap | EV/OCF | P/E | ||||
|---|---|---|---|---|---|---|
| KR |
S
|
Signetics Corp
KOSDAQ:033170
|
78.2B KRW | -5.9 | -1.6 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
4.9T USD | 46.8 | 40.5 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
1.9T USD | 65.8 | 76.3 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
53.2T TWD | 21.6 | 28.2 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
506.9B USD | 16.4 | 21 | |
| KR |
|
SK Hynix Inc
KRX:000660
|
701.7T KRW | 15.8 | 19.7 | |
| US |
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
463.7B USD | 59.1 | 107 | |
| US |
|
Intel Corp
NASDAQ:INTC
|
330.9B USD | 35 | -1 239.3 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
211.5B USD | 30.8 | 42.5 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
183.2B USD | 37 | 67.7 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
186.4B USD | 120.4 | 232.7 |
Market Distribution
| Min | 0 |
| 30th Percentile | 5.8 |
| Median | 10 |
| 70th Percentile | 18.7 |
| Max | 2 215 163.4 |
Other Multiples
Signetics Corp
Glance View
Signetics Corp. engages in the provision of semiconductor packaging services. The company is headquartered in Paju, Gyeonggi-Do. The company went IPO on 2010-11-26. The firm provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).
