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Signetics Corp
KOSDAQ:033170

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Signetics Corp
KOSDAQ:033170
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Price: 901 KRW -4.96%
Market Cap: ₩77.2B

P/E

-1.5
Current
4%
More Expensive
vs 3-y average of -1.5

Price to Earnings (P/E) ratio shows how much investors pay for each dollar of a company`s earnings. It`s calculated by dividing the company`s market value by its total earnings.

P/E
-1.5
=
Market Cap
₩74.3B
/
Net Income
₩-50.3B

Price to Earnings (P/E) ratio shows how much investors pay for each dollar of a company`s earnings. It`s calculated by dividing the company`s market value by its total earnings.

P/E
-1.5
=
Market Cap
₩74.3B
/
Net Income
₩-50.3B

Valuation Scenarios

Signetics Corp is trading above its industry average

If P/E returns to its Industry Average (17.2), the stock would be worth ₩-10 092.13 (1 220% downside from current price).

Statistics
Positive Scenarios
0/2
Maximum Downside
-1 220%
Maximum Upside
No Upside Scenarios
Average Downside
1 112%
Scenario P/E Value Implied Price Upside/Downside
Current Multiple -1.5 ₩901
0%
Industry Average 17.2 ₩-10 092.13
-1 220%
Country Average 13.9 ₩-8 136.27
-1 003%

Forward P/E
Today’s price vs future net income

Not enough data available to calculate forward P/E

Market Distribution

Lower than 100% of companies in Korea
Percentile
0th
Based on 1 157 companies
0th percentile
-1.5
Low
0.2 — 8.5
Typical Range
8.5 — 23.4
High
23.4 —
Distribution Statistics
Korea
Min 0.2
30th Percentile 8.5
Median 13.9
70th Percentile 23.4
Max 7 223

Signetics Corp
Glance View

Market Cap
77.2B KRW
Industry
Semiconductors

Signetics Corp. engages in the provision of semiconductor packaging services. The company is headquartered in Paju, Gyeonggi-Do. The company went IPO on 2010-11-26. The firm provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).

Intrinsic Value
1 127.53 KRW
Undervaluation 20%
Intrinsic Value
Price ₩901
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