Signetics Corp
KOSDAQ:033170
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P/E
Price to Earnings (P/E) ratio shows how much investors pay for each dollar of a company`s earnings. It`s calculated by dividing the company`s market value by its total earnings.
Price to Earnings (P/E) ratio shows how much investors pay for each dollar of a company`s earnings. It`s calculated by dividing the company`s market value by its total earnings.
Valuation Scenarios
If P/E returns to its Industry Average (17.2), the stock would be worth ₩-10 092.13 (1 220% downside from current price).
| Scenario | P/E Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | -1.5 | ₩901 |
0%
|
| Industry Average | 17.2 | ₩-10 092.13 |
-1 220%
|
| Country Average | 13.9 | ₩-8 136.27 |
-1 003%
|
Forward P/E
Today’s price vs future net income
Peer Comparison
| Market Cap | P/E | ||||
|---|---|---|---|---|---|
| KR |
S
|
Signetics Corp
KOSDAQ:033170
|
77.2B KRW | -1.5 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
5.2T USD | 43.1 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
1.9T USD | 75.8 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
57.4T TWD | 30 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
568.8B USD | 23.6 | |
| US |
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
526.8B USD | 121.5 | |
| KR |
|
SK Hynix Inc
KRX:000660
|
701.7T KRW | 20.8 | |
| US |
|
Intel Corp
NASDAQ:INTC
|
424.5B USD | -133.8 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
240.4B USD | 45 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
211B USD | 263.4 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
187.1B USD | 69.1 |
Market Distribution
| Min | 0.2 |
| 30th Percentile | 8.5 |
| Median | 13.9 |
| 70th Percentile | 23.4 |
| Max | 7 223 |
Other Multiples
Signetics Corp
Glance View
Signetics Corp. engages in the provision of semiconductor packaging services. The company is headquartered in Paju, Gyeonggi-Do. The company went IPO on 2010-11-26. The firm provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).