Transcom Inc
TWSE:5222
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EV/FCFF
Enterprise Value to Free Cash Flow to Firm (EV/FCFF) ratio compares a company`s total enterprise value to the free cash flow available to all investors, both debt and equity holders. It shows how much investors are paying for each dollar of cash flow the business generates before interest payments.
Enterprise Value to Free Cash Flow to Firm (EV/FCFF) ratio compares a company`s total enterprise value to the free cash flow available to all investors, both debt and equity holders. It shows how much investors are paying for each dollar of cash flow the business generates before interest payments.
Valuation Scenarios
If EV/FCFF returns to its 3-Year Average (26.5), the stock would be worth NT$97.86 (26% downside from current price).
| Scenario | EV/FCFF Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 35.6 | NT$131.5 |
0%
|
| 3-Year Average | 26.5 | NT$97.86 |
-26%
|
| 5-Year Average | 35.5 | NT$130.8 |
-1%
|
| Industry Average | 27.2 | NT$100.25 |
-24%
|
| Country Average | 20.4 | NT$75.08 |
-43%
|
Forward EV/FCFF
Today’s price vs future free cash flow to firm
Peer Comparison
| Market Cap | EV/FCFF | P/E | ||||
|---|---|---|---|---|---|---|
| TW |
T
|
Transcom Inc
TWSE:5222
|
12B TWD | 35.6 | 46.7 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
4.9T USD | 49.6 | 40.4 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
2T USD | 70.1 | 79.2 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
55.4T TWD | 50.4 | 29.3 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
583.4B USD | 56.4 | 24.2 | |
| US |
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
577.8B USD | 84.6 | 133.3 | |
| US |
|
Intel Corp
NASDAQ:INTC
|
474.6B USD | -155.4 | -149.5 | |
| KR |
|
SK Hynix Inc
KRX:000660
|
701.7T KRW | 35.7 | 20.7 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
254.9B USD | 70.8 | 47.8 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
223.4B USD | 229.8 | 278.9 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
196.4B USD | 43.9 | 72.6 |
Market Distribution
| Min | 0.4 |
| 30th Percentile | 13.5 |
| Median | 20.4 |
| 70th Percentile | 30.6 |
| Max | 2 037.1 |
Other Multiples
Transcom Inc
Glance View
Transcom, Inc. engages in the design, development, production, and sale of microwave semiconductor components. The company is headquartered in Tainan, Tainan. The company went IPO on 2012-12-19. The firm's main products include microwave amplifiers and modules, gallium arsenide low noise and power components, solid state power amplifiers and modules, microwave sub-system products and others. The firm's products are mainly used in mobile phones, wireless local area networks, point-to-point wireless communications, satellite communications, wireless surveillance devices and military applications. The firm distributes its products in domestic market and to overseas markets, including the rest of Asia, the Americas, Europe and others.
