GEM Services Inc
TWSE:6525
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EV/GP
Enterprise Value to Gross Profit (EV/GP) ratio compares a company`s total enterprise value to its gross profit. It shows how much investors are paying for each dollar of the company`s gross profit, including both equity and debt.
Enterprise Value to Gross Profit (EV/GP) ratio compares a company`s total enterprise value to its gross profit. It shows how much investors are paying for each dollar of the company`s gross profit, including both equity and debt.
Valuation Scenarios
If EV/GP returns to its 3-Year Average (6.7), the stock would be worth NT$94.86 (3% upside from current price).
| Scenario | EV/GP Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 6.5 | NT$92.4 |
0%
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| 3-Year Average | 6.7 | NT$94.86 |
+3%
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| 5-Year Average | 6.2 | NT$88.91 |
-4%
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| Industry Average | 6.8 | NT$96.62 |
+5%
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| Country Average | 7.7 | NT$110.37 |
+19%
|
Forward EV/GP
Today’s price vs future gross profit
Peer Comparison
| Market Cap | EV/GP | P/E | ||||
|---|---|---|---|---|---|---|
| KY |
G
|
GEM Services Inc
TWSE:6525
|
11.9B TWD | 6.5 | 15.7 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
4.9T USD | 31 | 40.2 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
2T USD | 44.1 | 79.9 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
55.4T TWD | 20.8 | 29.3 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
583.4B USD | 17.9 | 25.4 | |
| US |
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
577.8B USD | 33.8 | 135.6 | |
| KR |
|
SK Hynix Inc
KRX:000660
|
701.7T KRW | 11.7 | 16.1 | |
| US |
|
Intel Corp
NASDAQ:INTC
|
474.6B USD | 26.8 | -157.7 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
254.9B USD | 24.9 | 47.8 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
224.3B USD | 48.6 | 280 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
194.2B USD | 26.8 | 71.7 |
Market Distribution
| Min | 0 |
| 30th Percentile | 5 |
| Median | 7.7 |
| 70th Percentile | 10.2 |
| Max | 49.2 |
Other Multiples
GEM Services Inc
Glance View
GEM Services, Inc. manufactures semiconductor assembly and test contractor services. The firm specializes in small-outline surface-mount packages for power management semiconductors. Its customers are semiconductor manufacturers who require both industry standard and advanced packaging solutions as part of their portfolio of value-added products for portable, battery-powered communications, computing systems, industry and automobile applications. The company operates two factories in Greater China: Shanghai, China; Hefei, China, which produces industry standard and advanced discrete, integrated circuits (IC) and multi-chip module (MCM) packages, including concepts co-developed with customers. The Company’s products and services include packaging development, wafer processing, assembly services, electrical test, logistic services and reliability testing. Its electrical test includes discrete device electrical testing and analog and power IC electrical testing.
