ChipMOS Technologies Inc
F:CPIA
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ChipMOS Technologies Inc
ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2013-04-19. The firm mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. The company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2013-04-19. The firm mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. The company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Revenue Growth: Q2 2025 revenue increased 3.7% sequentially to TWD 5,736 million, driven by strong memory product demand despite weakness in auto and industrial sectors.
Gross Margin Decline: Gross margin fell to 6.6%, down 280 basis points quarter-over-quarter, largely due to DDIC ASP cuts, higher electricity costs, and NTD appreciation.
Net Loss: The company reported a net loss of TWD 533 million (TWD 0.75 per share), mainly from significant foreign exchange loss (TWD 690 million).
Memory Strength: Memory product revenue jumped 21.2% QoQ and is expected to outperform DDIC in Q3 due to favorable supply/demand and price increases.
Q3 Outlook: Management expects continued strength in memory and improving conditions for OLED and auto panels, with memory OSAT price hikes of 5–18% to offset cost inflation.
CapEx Discipline: CapEx remains conservative, targeted at high-growth, higher-margin areas, while preserving a strong balance sheet.
Dividend Policy: No change in dividend policy is planned for 2026; management expects stable payouts supported by retained earnings.
