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TongFu Microelectronics Co Ltd
SZSE:002156

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TongFu Microelectronics Co Ltd
SZSE:002156
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Price: 36.59 CNY -0.44% Market Closed
Market Cap: 55.5B CNY

TongFu Microelectronics Co Ltd
Net Issuance of Debt

Last Value
3 Years 3Y CAGR
5 Years 5Y CAGR
10 Years 10Y CAGR
Last Value
3 Years 3Y CAGR
5 Years 5Y CAGR
10 Years 10Y CAGR
Quarterly
Annual
TTM
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TongFu Microelectronics Co Ltd
Net Issuance of Debt Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Net Issuance of Debt CAGR 3Y CAGR 5Y CAGR 10Y
T
TongFu Microelectronics Co Ltd
SZSE:002156
Net Issuance of Debt
ÂĄ2B
CAGR 3-Years
-22%
CAGR 5-Years
-3%
CAGR 10-Years
18%
Semiconductor Manufacturing International Corp
HKEX:981
Net Issuance of Debt
$1B
CAGR 3-Years
-9%
CAGR 5-Years
19%
CAGR 10-Years
N/A
Cambricon Technologies Corp Ltd
SSE:688256
Net Issuance of Debt
ÂĄ100m
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
Will Semiconductor Co Ltd Shanghai
SSE:603501
Net Issuance of Debt
ÂĄ826.5m
CAGR 3-Years
-43%
CAGR 5-Years
-8%
CAGR 10-Years
N/A
GigaDevice Semiconductor Inc
SSE:603986
Net Issuance of Debt
-ÂĄ182.7m
CAGR 3-Years
-90%
CAGR 5-Years
-71%
CAGR 10-Years
N/A
H
Hygon Information Technology Co Ltd
SSE:688041
Net Issuance of Debt
ÂĄ1.8B
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
No Stocks Found

TongFu Microelectronics Co Ltd
Glance View

Market Cap
55.5B CNY
Industry
Semiconductors

In the bustling heart of China's semiconductor landscape, TongFu Microelectronics Co. Ltd. stands as a testament to the nation's drive towards technological excellence. Founded in 1997, TongFu emerged as a vital player amid the rapid growth of the global electronics market, focusing its expertise on providing comprehensive assembly and testing services. The company is deeply entrenched in the integrated circuit (IC) sector, offering solutions that include IC packaging, testing, and related services. By adhering to meticulous quality standards and leveraging sophisticated technology, TongFu has forged partnerships with leading chip manufacturers worldwide, enabling it to serve a diverse range of sectors from consumer electronics to high-demand telecommunications industries. The robust financial performance of TongFu Microelectronics is intricately linked to its strategic positioning within the semiconductor supply chain. Despite the volatile nature of this market, markable by cyclical highs and lows driven by technological advancements and fluctuating demand, TongFu turns its expertise into a steady revenue stream. By specializing in outsourced semiconductor assembly and test (OSAT), TongFu capitalizes on the growing trend of semiconductor design companies outsourcing these operations. This approach not only optimizes the company's resource utilization and broadens its client base but also ensures a steady workflow that translates into consistent revenue, positioning TongFu as an indispensable cog in the complex machinery of global technology manufacturing.

Intrinsic Value
52.85 CNY
Undervaluation 31%
Intrinsic Value
Price
T

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What is TongFu Microelectronics Co Ltd's Net Issuance of Debt?
Net Issuance of Debt
2B CNY

Based on the financial report for Sep 30, 2025, TongFu Microelectronics Co Ltd's Net Issuance of Debt amounts to 2B CNY.

What is TongFu Microelectronics Co Ltd's Net Issuance of Debt growth rate?
Net Issuance of Debt CAGR 10Y
18%

Over the last year, the Net Issuance of Debt growth was 136%. The average annual Net Issuance of Debt growth rates for TongFu Microelectronics Co Ltd have been -22% over the past three years , -3% over the past five years , and 18% over the past ten years .

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